PCB
Short Specifications
Details Specifications
Characteristics
Unit
Conditioning
Typical Values
SPEC
Test Method
Permittivity
Process
-
10GHz/23℃
3.0
-
2.5.5.5
Design
-
3.0
Differential
phase length
Loss Tangent
-
10GHz/23℃
0.0026
-
2.5.5.5
0.0028
SPDR
Thermal Coefficient of Dkr
ppm/°C
10 GHz - 50 to 150 °C
76
IPC-TM-650 2.5.5.13
Volume resistivity
MΩ-cm
C-96/35/90
109
106 h
IPC-TM-650 2.5.17
Surface resistivity
MΩ
C-96/35/90
108
104 h
IPC-TM-650 2.5.17
Arc resistance
SEC
D-48/50+D-0.5/23
180h
60 h
IPC-TM-650 2.5.1
Dielectric breakdown
KV
D-48/50
45h
20 h
IPC-TM-650 2.5.6
Td (5% weight loss)
℃
TGA, 10℃/min
540
450 h
ASTM D3850
CTE (z) (25 - 260°C)
ppm/℃
TMA
70-90
N/A
IPC-TM-650 2.4.24
CTE (x,y) (25 - 260°C)
ppm/℃
TMA
20-30
N/A
IPC-TM-650 2.4.24
Thermal stress
SEC
288℃x10” solder dipping
300 h
10h
IPC-TM-650 2.4.13.1
Peel strength 1 oz
lb/in
288℃x10” solder floating
10
6h
IPC-TM-650 2.4.8
Moisture absorption
%
D-24/23
0.04
0.15↓
IPC-TM-650 2.6.2.1
Density (Specific Gravity)
g/cm3
2.1
2.05~2.15
ASTM D792
Flammability
-
C-48/23/50
V-0
V-0
UL94
Thermal Conductivity
W/mK
0.6
0.2h
ASTM F 433
Dimensional stability X-Y axis
%
E-0.5/170
0.01-0.03
0.05↓
IPC-TM-650 2.4.39
Passive Intermodulation
dBc
158
<-153
: IEC-62037
Dk
(10GHz)
Df
(10GHz)
Dielectric Thickness
(mm)
Copper foil
(oz)
Copper Thickness
(mm)
Equivalent
3.0
0.0022
0.25
0.5
0.76
1.52
3.2
1
0.035
AD300C
SCGA 500 GF300
ZYF300CA
0.5
0.018
- Stable dielectric constant
- Low moisture absorption
- Excellent dimensional stability
- Ultra-low loss
- Excellent peel strength
- Low PIM
- Base Station Antennas
- 5G Infrastructure
- RF Passive Components
- Power Amplifiers (PA)
